Typically used in high power applications like power amplifiers where heat dissipation is essential, there are two options available:
Pre-Bonded - PTFE is supplied pre-bonded to a metal backing of aluminium, copper or brass. Use of plated through holes provides an integral ground and thermal path to the metal backing.
Post-Bonded - The standard configuration is to produce a standard double sided RF/microwave PCB and subsequently bond it to the chosen type and thickness of metal backing using a silver loaded electrically and thermally conductive adhesive. The post-bonded method widens the range of options regarding dielectric and metal backing configurations.
All CNC operations are performed in house.
